Adhesion ant kouch galvanoplastie a ak substra plastik ki te jwenn nan tib chofaj elektrik galvanoplastie vakyòm.

Adhesion ant kouch galvanoplastie a ak substra plastik ki te jwenn nan tib chofaj elektrik galvanoplastie vakyòm.

Vacuum plating bezwen vaporize metal la oswa oksid metal, ak tanperati chofaj la pa ta dwe twò wo, otreman, gaz metal la pral depoze sou substra plastik la pou lage chalè ak boule substra plastik la. Patikil yo sputtered yo diman afekte pa gravite, ak sib la ak la Pozisyon an nan substra a ka lib ranje, dansite nan nukleasyon se wo nan etap inisyal la nan fòmasyon fim, ak ekstrèmman mens fim kontinyèl anba a 10nm ka pwodwi. Objektif la gen yon lavi ki long epi yo ka otomatize ak kontinyèlman pwodwi pou yon tan long. Sib la ka fèt nan divès fòm, ak konsepsyon espesyal machin nan pou pi bon kontwòl ak pwodiksyon ki pi efikas. Sputtering sèvi ak yon jaden elektrik wo-vòltaj pou jenere materyèl kouch Plasma, lè l sèvi avèk prèske tout metal gwo pwen k ap fonn, alyaj ak oksid metal. Tankou: chromium, molybdène, tengstèn, Titàn, ajan, lò, elatriye Anplis, li se yon pwosesis depo fòse. Adhesion ki genyen ant kouch galvanoplastik la ak substra plastik ki te jwenn nan pwosesis sa a pi wo pase metòd galvanoplastie vakyòm lan. Men, pri a pwosesis Relativman wo.

Vacuum plating elektrik chofaj tib adezyon fim se pi bon pase evaporasyon

Magnetron sputtering: an orthogonal electromagnetic field is formed on the surface of the cathode target, the electron density in this area is high, and the ion density is further increased, so that the sputtering rate is increased (one order of magnitude), and the sputtering speed can reach 0.1-1um/min. The focus is better than evaporation, and it is one of the most practical coating technologies at present. Others include bias sputtering, reactive sputtering, ion beam sputtering and other coating technologies. Sputtering machine equipment and technology (magnetron sputtering) It consists of vacuum chamber, exhaust system, sputtering source and control system. The sputtering source is further divided into power supply and sputter gun. The magnetron sputtering gun is divided into flat type and cylindrical type. The flat type is divided into rectangular type and circular type. The target material utilization rate is 30-40%. The cylindrical target Material utilization >50 pousan Sputtering ekipman pou pouvwa divize an: kouran dirèk (DC), frekans radyo (RF), batman kè (batman kè), DC: 800-1000V (Max) pou kondiktè, dwe kapab dezas arc. RF: 13.56MHZ, ki pa kondiktè.

Ki sa ki atik yo enspeksyon apre galvanoplastie nan vakyòm electroplating tib chofaj elektrik

1. Epesè fim;

2. Enspeksyon asanble;

3. Adhesion kouch;

4. Tès dite;

5. Mete tès la;

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